Ehrenfried Zschech

Biography

Prof. Dr. Ehrenfried Zschech is a consultant with hands-on experience in the fields of materials science and engineering, nanotechnology, and microelectronics. He holds honorary professorships in Nanomaterials at Brandenburg University of Technology Cottbus-Senftenberg and in Nanoanalysis at Dresden University of Technology, and he is a Guest Chair Professor at Southeast University, Nanjing, China. He has published three books, and he has authored or co-authored more than 400 papers in peer-reviewed journals in the areas of solid-state physics, materials characterization, and reliability engineering. Ehrenfried Zschech is a Member of the European Academy of Science (EurASc) and a Member of the German National Academy of Science and Engineering (ACATECH). In 2019, he was awarded the FEMS European Materials Gold Medal, in 2023 the DGM Pioneer Award, and with the Roland Mitsche Prize. Ehrenfried Zschech received his Dr. rer. nat. degree from Dresden Universityof Technology. After spending four years as a project leader in the field of metal physics and reliability of microelectronic interconnects at the Research Institute for Nonferrous Metals in Freiberg, he was appointed as a university teacher in ceramic materials at Freiberg University of Technology. In 1992, he joined the development department at Airbus in Bremen, where he managed the metal physics group and studied the laser-welding metallurgy of aluminum alloys. From 1997 to 2009, Ehrenfried Zschech managed the Materials Analysis Department and the Center for Complex Analysis at Advanced Micro Devices in Dresden. In this position, he was responsible for the analytical support for process control and technology development in leading-edge semiconductor manufacturing, as well as for physical failure analysis. Ehrenfried Zschech was Department Head at the Fraunhofer Institutes IZFP and IKTS and Head of the Steering Committee of the Dresden Fraunhofer Cluster Nanoanalysis from 2009 to 2021. His responsibilities included multi-scale materials characterization and reliability engineering. From 2021 to 2023, he was acting as CTO and Co-Founder of deepXscan GmbH, Dresden, Germany. This start-up company developed and commercialized high-resolution X-ray imaging systems providing customized solutions for a broad range of applications, for materials science, energy technologies and microelectronics.